Product Introduce제품소개

HOT PRESS (LAY-UP LINE)MULTI LAYER HOT PRESS SYSTEM (LED, PCB, Laminate)

HOT PRESS

SPECIFICATION

  • PLATEN SIZE1.370 X 2,400 X 60 (mm)
  • OPENING20
  • THICKNESS DEVIATION20㎛
  • HYD. PRESS POWERpressure:Max 1,400ton (PLATE:49kgf/㎠)
  • AUTO CONTROLTOUCH SCREEN
  • SYSTEMAuto Program Control
  • VACUUMMax. 20 Torr
  • TEMP. CONTROLStandard Gap : ±2°C
    Plate Temp : Max. 250°C

UNIT DEVICE

  • AL B/D AUTO FEEDING
  • RCC CUTTING M/C
  • DOUBLE TRANSFER
  • SUS WASHING UNIT
  • SHEARING M/C
  • PACKING M/C
  • 레이업된 캐리어를 다단 분리하여 핫프레스, 스테커의 프로그램에 따라 전자동 작업가능
  • LED 기판 등 성형