Product Introduce제품소개

반도체장비CHEBICAL POLISHING MACHINE

SPECIFICATION

  • Working SizeMax. Dia 400mm * 4
  • PressureMax. 400kg ( 1 Head ) * 4 Head
  • Turn Table SizeØ1300
  • Turn Table Speed Max. 60 rpm ( Main motor : 22kw * 1/30 )
  • OcillationMax. 30 rpm ( Motor : 5.5kw * 1/60 )
  • Pressure Control Multistage Control ( 20 Step )
  • Control SystemTouch Screen + PLC ( HMI System)

FEATURE

  • 4 Head Simultaneous Operation ( Increased Productivity )
  • Pressure Multi Stage Control ( 20 Step Adjustable )
  • Ocillation System ( Stroke 30~80mm )
  • Turn Table Cooling System ( Cooling Temperature Adjustable )
  • Automatic Slurry Supply System