Product Introduce제품소개

SEMICONDUCTOR LAPPING MACHINE

SPECIFICATION

  • Working SizeMax. Dia 400mm * 1
  • PressureMax. 100kg ( 1 Head ) * 1 Head
  • Turn Table SizeØ1000
  • Turn Table Speed Max. 30 rpm ( Main motor : 5.5kw * 1/30 )
  • OcillationMax. 30 rpm ( Motor : 2.2kw * 1/60 )
  • Pressure Control Regulator Control
  • Control SystemTouch Screen + PLC ( HMI System )

FEATURE

  • Excellent Workability ( Produce Superior Quality Products )
  • Ocillation System ( Stroke 30~80mm )
  • Ocillation System ( Stroke 30~80mm )
  • Turn Table Casting Production ( High intensity Quality, Reusable after Polishing )
  • Automatic Slurry Supply System